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Shenzhen Hongyunlai Electronic Technology Co. Ltd
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aluminum base board
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aluminum base board
Specification: Aluminum substrate copper clad
Detail: surface treatment:OSP,immersion Gold,Immersion Tin,Immersion silver,Lead Free Air Leveing,ickel -Gold plating. Layers£º1-4layer Maximum measurement£º500*650mm Molding dimension tolerance£º¡À0.15mm Delivery cycle£ºngle temp...
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